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1 electronics package
Military: EPУниверсальный русско-английский словарь > electronics package
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2 flight control electronics package container
Military: FCEPCУниверсальный русско-английский словарь > flight control electronics package container
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3 shipboard tracking electronics package
Engineering: STEPУниверсальный русско-английский словарь > shipboard tracking electronics package
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4 spacecraft electronics package
Engineering: SEPУниверсальный русско-английский словарь > spacecraft electronics package
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5 standard electronics package
Military: SEPУниверсальный русско-английский словарь > standard electronics package
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6 Package Level Detail
Electronics: PLDУниверсальный русско-английский словарь > Package Level Detail
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7 Ceramic dual in-line package
Electronics: CER-DIPУниверсальный русско-английский словарь > Ceramic dual in-line package
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8 Multi- Chip Package
Electronics: MCPУниверсальный русско-английский словарь > Multi- Chip Package
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9 Quad Flat J-leaded Package
Electronics: QFJУниверсальный русско-английский словарь > Quad Flat J-leaded Package
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10 Quad Flat No-lead package
Electronics: QFNУниверсальный русско-английский словарь > Quad Flat No-lead package
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11 Single Chip Package
Electronics: SCPУниверсальный русско-английский словарь > Single Chip Package
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12 Single Inline Package
Electronics: SIPУниверсальный русско-английский словарь > Single Inline Package
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13 Small Outline with J Lead Package
Electronics: SOJУниверсальный русско-английский словарь > Small Outline with J Lead Package
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14 Thin Flat Package
Electronics: TFP -
15 Thin Quad Flat Package
Electronics: TQFPУниверсальный русско-английский словарь > Thin Quad Flat Package
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16 Thin Shrink Small Outline Package
Electronics: TSSOPУниверсальный русско-английский словарь > Thin Shrink Small Outline Package
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17 Ultra Small Outline Package
Electronics: USOPУниверсальный русско-английский словарь > Ultra Small Outline Package
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18 Wafer Level Package
Electronics: WLPУниверсальный русско-английский словарь > Wafer Level Package
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19 ceramic dual in-line package
Electronics: CER-DIPУниверсальный русско-английский словарь > ceramic dual in-line package
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20 shrink small outline package
High frequency electronics: SSOPУниверсальный русско-английский словарь > shrink small outline package
См. также в других словарях:
Package — can refer to:*Packaging and labelling *Mail item larger than a letter *Software package, in computing, a type of file format where software programs and installation material is grouped together **Java package, a concept programming where related … Wikipedia
List of electronics package dimensions — Surface mount dimension reference = C Clearance between IC body and PCB H Total Height T Lead Thickness L Total Carrier Length LW Lead Width LL Lead Length P Pitch WB IC Body Width WL Lead to Lead Width Through pin dimension reference C Clearance … Wikipedia
package — 01. There s a [package] for you waiting to be picked up at the post office. 02. Did you look at the ingredients on this [package] of cookies? They re full of additives. 03. The West has put together an aid [package] to help out those countries… … Grammatical examples in English
Dual in-line package — PDIP redirects here. PDIP may also refer to Indonesian Democratic Party – Struggle. Three 14 pin (DIP14) plastic dual in line packages containing IC chips … Wikipedia
Samsung Electronics — В данной статье или разделе имеется список источников или внешних ссылок, но источники отдельных утверждений остаются неясными из за отсутствия сносок … Википедия
Chip scale package — A chip scale package (CSP) (sometimes, chip scale package with a hyphen) is a type of integrated circuit chip carrier. Originally, CSP was the acronym for chip size packaging. Since only a few packages are chip size, the meaning of the acronym… … Wikipedia
Samsung Electronics — Koreanische Schreibweise koreanisches Alphabet: 삼성전자 Revidierte Romanisierung: Samseongjeonja McCune Reischauer: Samsung … Deutsch Wikipedia
National Instruments Electronics Workbench Group — The National Instruments Electronics Workbench Group[1] is responsible for innovating the electronic circuit design software NI Multisim and NI Ultiboard[2], which was previously a Canada based company that first produced MultiSIM, and integrated … Wikipedia
List of electronics topics — Alphabetization has been neglected in some parts of this article (the b section in particular). You can help by editing it. This is a list of communications, computers, electronic circuits, fiberoptics, microelectronics, medical electronics,… … Wikipedia
Quad-flat no-leads package — 28 pin QFN, upside down to show contacts and thermal/ground pad Flat no leads packages such as QFN (quad flat no leads) and DFN (dual flat no leads) physically and electrically connect integrated circuits to printed circuit boards. Flat no leads … Wikipedia
Samsung Electronics — 삼성전자 Type Public Korean: 삼성전자 Traded as KRX: 005930 … Wikipedia